发明名称 |
Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
摘要 |
The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
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申请公布号 |
US7750461(B2) |
申请公布日期 |
2010.07.06 |
申请号 |
US20040515633 |
申请日期 |
2004.12.06 |
申请人 |
CURAMIX ELECTRONICS GMBH |
发明人 |
SCHULZ-HARDER JUERGEN;HABERL PETER |
分类号 |
H01L23/12;H01L23/053;H01L23/373;H01L25/16;H05K1/03;H05K1/09;H05K3/28;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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