发明名称 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
摘要 The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
申请公布号 US7750461(B2) 申请公布日期 2010.07.06
申请号 US20040515633 申请日期 2004.12.06
申请人 CURAMIX ELECTRONICS GMBH 发明人 SCHULZ-HARDER JUERGEN;HABERL PETER
分类号 H01L23/12;H01L23/053;H01L23/373;H01L25/16;H05K1/03;H05K1/09;H05K3/28;H05K3/46 主分类号 H01L23/12
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