METHOD OF MACHINING U-SHAPED GROOVE OF SUBSTRATE OF FRAGILE MATERIAL, REMOVAL METHOD, BORING METHOD AND CHAMFERING METHOD USING THE SAME METHOD

摘要

A method of easily forming a linear or curved continuous or discontinuous U-shaped groove on a substrate surface, and a chamfering method using the same. Part of the surface of a substrate made of a fragile material is rapidly heated under laser irradiation conditions for forming the U-shaped groove consisting of a predefined combination of laser power, a laser irradiation area and scanning speed according to a substrate material to be machined, a groove width of the U-shaped groove to be formed, a depth and a shape of a groove surface, thereby exfoliating part of the substrate from the surface and forming the U-shaped groove. A chamfered face comprising a groove surface constituted of part of the U-shaped groove formed between an end surface segmented from an expected segmentation line and the substrate surface is formed by a method of scribing from an initial end of the expected segmentation line set on the bottom of the groove toward a terminal end by means of laser crack growth, a method of scribing by means of a cutter wheel or the like.