发明名称 |
Semiconductor device having a sensor chip, and method for producing the same |
摘要 |
A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
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申请公布号 |
US7749797(B2) |
申请公布日期 |
2010.07.06 |
申请号 |
US20050574861 |
申请日期 |
2005.08.18 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER MICHAEL;HAIMERL ALFRED;KESSLER ANGELA;MAHLER JOACHIM;SCHOBER WOLFGANG |
分类号 |
H01L21/00;H01L21/48;H01L23/28;H01L31/0203 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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