Solder repairing apparatus and method of repairing solder

摘要

A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate is designed to move into the specific spot in a vertical attitude perpendicular to the reference plane. The dividing plate exhibits a low solder wettability. The solder melts in response to the application of the thermal energy. When the dividing plate in the vertical attitude enters the specific spot, the dividing plate gets into the solder. Since the dividing plate exhibits a low solder wettability, the dividing plate repels the solder. The solder is divided into two parts. The division of the solder reliably eliminates a short circuit in the electronic circuit.