| 摘要 |
PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to polish a wafer with the polished surface faced upward, thereby removing the need for turning the wafer upside down. CONSTITUTION: A CMP apparatus(100) comprises a polishing platen(110), a mounting unit(120), and a polishing head(130). The polishing platen is rotated with a rotational driving unit(111). The mounting unit is installed on the upper side of the polishing platen. A wafer(W) is installed in the mounting unit with a polished surface(P) exposed upward. The polishing head is installed on the top of the polishing platen to rotate a polishing pad(131) and polish the polished surface of the wafer. |
