| 摘要 |
<p>PURPOSE: A metal layer deposition apparatus of a semiconductor is provided to implement the EBR(Edge Bevel Removal) process normally by determining the status of normal position of a wafer edge area or the status of etching of the wafer edge area. CONSTITUTION: A semiconductor wafer inserted into a chamber(100) is loaded on a fixing pin(120). A pedestal(110) rotates the wafer. An etching nozzle(130) is located on the upper part of the pedestal. The etching nozzle eliminates the metal layer of the edge area by spraying the etching member. A sensor(160) senses the presence of the metal layer.</p> |
