发明名称 Cooling arrangement to cool components on circuit board
摘要 A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.
申请公布号 US7751189(B2) 申请公布日期 2010.07.06
申请号 US20070852158 申请日期 2007.09.07
申请人 INTEL CORPORATION 发明人 AHUJA SANDEEP;SAUCIUC IOAN
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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