发明名称 Fingerprint sensing assemblies and methods of making
摘要 A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
申请公布号 US7751601(B2) 申请公布日期 2010.07.06
申请号 US20050243100 申请日期 2005.10.04
申请人 VALIDITY SENSORS, INC. 发明人 BENKLEY, III FRED G.
分类号 G06K9/00;G01R27/16 主分类号 G06K9/00
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