| 摘要 |
An epoxy resin composition which comprises acid anhydrides and epoxy resins, wherein 50-90 mass% of the acid anhydrides is accounted for by cyclohexane-1,2,4-tricarboxylic acid 1,2-anhydride, 30-90 mass% and 10-50 mass% of the epoxy resins are accounted for by an alicyclic epoxy resin compound and an epoxy resin compound represented by the following general formula (1), respectively, and the acid anhydrides and the epoxy resins are contained in such a proportion that the acid anhydride/epoxy resin proportion is in the range of 0.4-0.7 in terms of equivalent ratio. Also provided are a cured object obtained from the composition and a light-emitting diode. This epoxy resin composition has the following properties: (1) the composition after preparation has a low viscosity, a low degree of viscosity increase in standing at room temperature, and excellent applicability; the composition has satisfactory curability even when a curing accelerator is not added thereto; and the composition gives a cured object which is colorless and transparent, has crack resistance, and is reduced in discoloration with long-term light irradiation and heating. The composition is suitable for use as an encapsulation material for photo-electric converting elements, e.g., blue LEDs and white LEDs. (In the formula, Rs independently are hydrogen or methyl, m is an integer of 1-3, and n is an integer of 2-8.) [Chemical formula 1]. (1) |
