SEMICONDUCTOR PACKAGE AND METHOD OF FORMATION OF THE SAME

摘要

PURPOSE: A semiconductor package and a forming method thereof are provided to reduce stress applied to a first semiconductor chip by dispersively stacking second and third semiconductor chips on both sides of the first semiconductor chip. CONSTITUTION: A lead frame(101) comprises a first side and a second side opposite to the first side. The lead frame comprises a plurality of conductive leads arranged around a penetration hole. A first semiconductor chip(110) is flip-chip-bonded on the first surface of the plurality of leads. The second semiconductor chip is wire-bonded on the second surface of the plurality of leads. A third semiconductor chip(130) is stacked on the first semiconductor chip and is wire-bonded on the first surface of the plurality of leads.