发明名称 PRESSURE SENSITIVE ADHESIVE SHEET AND PROCESS FOR MANUFACTURING ELECTRONIC PART
摘要 <p>A pressure sensitive adhesive sheet comprising a sheetlike base material and, superimposed on one major surface thereof, a pressure sensitive adhesive layer, wherein the average surface roughness on one major surface of the base material is in the range of 0.1 to 3.5μm and on the other major surface thereof is in the range of 0.05 to 0.7μm. In this structure, the average surface roughness values on both the major surfaces of the base material as a constituent of the pressure sensitive adhesive sheet are regulated so as to fall within respective specified ranges, so that not only can any blocking occurring in backwinding of reeled pressure sensitive adhesive sheet be inhibited but also any occurrence of minute unevenness (waving) on the wafer surface after grinding can be inhibited, and further that the transparency of the pressure sensitive adhesive sheet can be maintained.</p>
申请公布号 KR20100075442(A) 申请公布日期 2010.07.02
申请号 KR20107005909 申请日期 2007.08.30
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 KUTSUMI MASANOBU;KUME MASASHI
分类号 C09J7/02;C09J133/08;C09J133/14;H01L21/304 主分类号 C09J7/02
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