发明名称 PACKAGE FOR PLANAR LIGHTWAVE CIRCUIT WITH HEAT SPREADER
摘要 PURPOSE: A package in which a planar light-wave circuit(PLC) is integrated with a heat spreader is provided to improve the operational stability of a PLC device by radiating heat from the PLC device. CONSTITUTION: A heat spreader(10) includes an upper metal film, an insulating film, a lower metal film and a protective film. The heat spreader is formed into a housing shape with a wick structure. A PLC chip(20) is attached on the upper metal film of a heat spreader. The heat spreader and the PLC chip are packaged. The insulating film is composed of ceramics.
申请公布号 KR20100074514(A) 申请公布日期 2010.07.02
申请号 KR20080132974 申请日期 2008.12.24
申请人 KOREA ELECTRONICS TECHNOLOGY INSTITUTE 发明人 YOON, HYUNG DO;HWANG, SUNG MIN;SUH, MOON SUHK;SEO, YONG GON
分类号 H01L23/36;G02B6/10 主分类号 H01L23/36
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