发明名称 |
PACKAGE FOR PLANAR LIGHTWAVE CIRCUIT WITH HEAT SPREADER |
摘要 |
PURPOSE: A package in which a planar light-wave circuit(PLC) is integrated with a heat spreader is provided to improve the operational stability of a PLC device by radiating heat from the PLC device. CONSTITUTION: A heat spreader(10) includes an upper metal film, an insulating film, a lower metal film and a protective film. The heat spreader is formed into a housing shape with a wick structure. A PLC chip(20) is attached on the upper metal film of a heat spreader. The heat spreader and the PLC chip are packaged. The insulating film is composed of ceramics. |
申请公布号 |
KR20100074514(A) |
申请公布日期 |
2010.07.02 |
申请号 |
KR20080132974 |
申请日期 |
2008.12.24 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
YOON, HYUNG DO;HWANG, SUNG MIN;SUH, MOON SUHK;SEO, YONG GON |
分类号 |
H01L23/36;G02B6/10 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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