| 摘要 |
PURPOSE: A probe card is provided to prevent semiconductor dies from damaging due to probe needles by forming a contact mark diagonally on a semiconductor die bond pad. CONSTITUTION: A conductive pattern is formed on the upper side of a printed circuit board(PCB) substrate(110). A plurality of probe needles(120) is attached on the PCB substrate. The probe needles are arranged in parallel. The probe needles are expanded to have an inclined angle with respect to the vertical direction. The inclined angle is between 25 degrees and 75 degrees. The probe needles have needle tips(121) which are bent to a direction opposite with the PCB substrate.
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