发明名称 |
METHOD FOR MANUFACTURING DOUBLE LAYER COPPER CLAD LAMINATED BOARD, AND DOUBLE LAYER COPPER CLAD LAMINATED BOARD |
摘要 |
<p>Provided is a method for manufacturing a double layer copper clad laminated board characterized in having improved folding endurance of 150 times or more, as a result of folding endurance test conforming to JIS C6471, by performing heat treatment at a temperature of 100°C or higher but not higher than 175°C to the double layer copper clad laminated board having a copper layer formed on a polyimide film by sputtering and plating. The method is provided for manufacturing the double layer copper clad laminated board (double layer CCL material) wherein the copper layer is formed on the polyimide film by sputtering and plating, folding endurance is improved and breakage of an outer lead section of a circuit is eliminated, and such double layer copper clad laminated board is also provided.</p> |
申请公布号 |
KR20100075665(A) |
申请公布日期 |
2010.07.02 |
申请号 |
KR20107011617 |
申请日期 |
2008.12.15 |
申请人 |
NIPPON MINING&METALS CO., LTD. |
发明人 |
HANAFUSA MIKIO |
分类号 |
B32B15/088;H05K1/09;H05K3/22 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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