METHOD FOR FORMING LAYER HAVING UNIFORMED THICKNESS

摘要

PURPOSE: A method for forming a layer with a uniform thickness is provided to improve the thickness uniformity of a thin film on a wafer by suppressing the volatilization of a liquid compound and minimizing the viscosity change. CONSTITUTION: An object to be coated is loaded in a chamber(10). A vaporized auxiliary solvent is injected in the chamber, a remained air in the chamber is discharged through an exhaust pipe(40). An liquid compound is sprayed onto the object to be coated under the vaporized auxiliary solvent atmosphere. The object to be coated rotates to uniform the thickness of the sprayed liquid compound. Air is injected from the outside. The vaporized auxiliary solvent is discharged and the coated object is unloaded.