| 摘要 |
PURPOSE: A physical vapor deposition apparatus is provided to prevent the temperature difference on a wafer in a physical vapor deposition process by improving the structure of a hot plate. CONSTITUTION: A physical vapor deposition apparatus includes a hot plate(30) in which a wafer is received. Gas lines(33) are formed with a radial shape and a circular shape. The radial gas line is formed on the upper side of the hot plate. The circular gas line is formed around the center of the hot plate. The circular gas line is formed with a plurality of concentric circles around the center of the hot plate. The plurality of concentric circles is separated with the same space.
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