| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier member for manufacturing a substrate and a method of manufacturing the substrate using the same, capable of easily and inexpensively manufacturing, and efficiently using the carrier member, by using the carrier member for manufacturing the substrate as a part of the substrate. SOLUTION: The method includes: preparing a carrier member 100a for manufacturing the substrate comprising insulating layers 114a, 114b and metal layers 116a, 116b sequentially disposed on both sides of a mold release layer 112; patterning the metal layers 116a, 116b to form base circuit layers; forming buildup layers on the base circuit layers; performing a routing process to separate the insulating layers 114a, 114b from the mold release layer 112; and forming solder-resist layers on an outermost layer of the buildup layers and processing open parts in the solder-resist layers and the insulating layers 114a, 114b to expose pad parts. COPYRIGHT: (C)2010,JPO&INPIT |
