| 摘要 |
<P>PROBLEM TO BE SOLVED: To selectively remove at least a part of a material disposed on a substrate for a medium having a large surface area. Ž<P>SOLUTION: A material removing method includes a step (step S14) for applying a UV curing adhesive on at least a part of the material disposed on the substrate for the medium, a step (step S16) for superposing a transparent substrate on the substrate for the medium, a step (step S18) for irradiating at least a part of the UV curing adhesive with light via the transparent substrate and a step (step S20) for removing the UV curing adhesive irradiated with light and the material in contact with the adhesive by peeling the transparent substrate from the substrate for the medium. Thereby, only the material to be desirably removed can be selectively removed by irradiating only the UV curing adhesive in contact with the material to be desirably removed with light. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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