发明名称 METHOD AND APPARATUS FOR FORMING MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To remove an excessive insulating glue on a substrate by a simple step without entering the insulating glue injected between substrates. SOLUTION: After an insulating glue is injected between the stacked substrates, an injection opening used for injecting the insulating glue is sealed. Here, the insulating glue injected between the substrates is not allowed to cure. The substrate is cleaned in a cleaning liquid after the injection opening is sealed, to remove the insulating glue on the outside of the substrate and the injection opening. By cleaning the outside of substrate in the cleaning liquid while the injection opening is sealed, an excessive insulating glue can be removed without entering the insulating glue injected between the substrates. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147184(A) 申请公布日期 2010.07.01
申请号 JP20080321413 申请日期 2008.12.17
申请人 SHIMADZU CORP 发明人 AZUMA MASAHISA;OKAMOTO HIDEKI;NAKAO EISAKU
分类号 H01L21/02 主分类号 H01L21/02
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