| 摘要 |
Semiconductor packages and methods for making and using such semiconductor packages are described. The semiconductor packages contain a dual gauge heat sink exposed on an upper part of the package, a leadframe containing a gate lead and an exposed drain pad on a lower part of the package, and a semiconductor die containing an IC device located between the heat sink and the leadframe. The gate of the IC device is connected to the gate lead of the leadframe using a bond interconnect wire or a gate interconnect clip located and placed under the heat sink and in between the heat sink and main leadframe. Such a configuration provides both a simple design for the semiconductor package and a simple method of manufacturing. Other embodiments are described.
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