| 摘要 |
<p>Disclosed are a liquid resin composition, with which high filling is possible in flip-chip type semiconductor devices, and which has excellent filling properties in narrow gaps, and a highly reliable semiconductor device using the same. The liquid resin composition is a liquid resin composition that contains (A) an epoxy resin, (B) an epoxy resin curing agent, and (C) a filler, wherein the content of (C) filler between 60-80% by weight of the entirety of the liquid resin composition, and wherein the contact angle (?) of the liquid resin composition, measured according to JIS R3257, is 30° or less at 110°C.</p> |
