| 摘要 |
PURPOSE: A molding compound is provided to obtain desirable electronic-mechanical properties including a low thermal expansion coefficient, a moderate glass transition temperature, a low modulus of elasticity, low moisture absorption, and high thermal conductivity and to form a shallow laser mark in a mold cap. CONSTITUTION: A molding compound includes a resin, filler, a plurality of carbon nanotubes, and a nanotube dispersed solution. The nanotube dispersed solution has a mean aggregate size less than 1 micron. The resin includes an epoxy group and the filler has silica. The filler is included with an amount of 60 - 89 wt% to the molding compound. The carbon nanotube is functionalized. |
