发明名称 Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder
摘要 The module (2) has a connection element i.e. contact spring (12), provided with a circular contact device, a semi circular contact device and a spring section. The circular contact device is electrically connected with contact surfaces (10) of a substrate (8). Deformation sections are formed at start and end points of the semi circular contact device. The contact spring is pressurized with the pressure by stoppers (20, 22) of a pressure piece (6) for pre-stressing the contact spring using the deformation units.
申请公布号 DE102008057832(B4) 申请公布日期 2010.07.01
申请号 DE20081057832 申请日期 2008.11.19
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 LEDERER, MARCO
分类号 H01L23/12;H01L23/02;H01L23/32;H01L23/48;H01L25/16;H05K3/32 主分类号 H01L23/12
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