| 摘要 |
PURPOSE: A method for fabricating a cylinder type capacitor is provided to prevent the leakage current of a capacitor by suppressing a bridge between bottom electrodes. CONSTITUTION: A mold layer, a pinned layer, and a stress relief layer are successively formed on a semiconductor substrate(100). An opening hole(301) passing through the stress relief layer, the pinned layer, and the mold layer is formed. A filler(601) filling the dent(430) on the side wall of the opening hole is formed. A bottom electrode following the profile of the opening hole is formed. The dielectric layer and a top electrode are formed on the bottom electrode.
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