发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE: A thermoplastic resin composition is provided to have a secured matter property including flexural modulus and to apply the composition for a molded product, including cellular phones or electronics. CONSTITUTION: A thermoplastic resin composition contains the following: 100 parts of base resin by weight containing 20~90wt% of polyester resin and 20~80wt% of polycarbonate resin; and 3~25 parts of reinforcing agent by weight containing glycidyl methacrylate. The polyester resin is selected from the group consisting of a polyethylene terephthalate resin, a polytrimethylene terephthalate resin, a polybutylene terephthalate resin, a polyhexamethylene terephthalate resin, a polycyclohexane dimethylene terephthalate resin, or their combination.
申请公布号 KR20100072804(A) 申请公布日期 2010.07.01
申请号 KR20080131317 申请日期 2008.12.22
申请人 CHEIL INDUSTRIES INC. 发明人 CHANG, YOUNG SUK;KIM, BANG DUK;LEE, YWAN HEE;PARK, JUNG EUN
分类号 C08L67/03;C08L51/04;C08L67/00;C08L69/00 主分类号 C08L67/03
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