发明名称 |
THERMOPLASTIC RESIN COMPOSITION |
摘要 |
PURPOSE: A thermoplastic resin composition is provided to have a secured matter property including flexural modulus and to apply the composition for a molded product, including cellular phones or electronics. CONSTITUTION: A thermoplastic resin composition contains the following: 100 parts of base resin by weight containing 20~90wt% of polyester resin and 20~80wt% of polycarbonate resin; and 3~25 parts of reinforcing agent by weight containing glycidyl methacrylate. The polyester resin is selected from the group consisting of a polyethylene terephthalate resin, a polytrimethylene terephthalate resin, a polybutylene terephthalate resin, a polyhexamethylene terephthalate resin, a polycyclohexane dimethylene terephthalate resin, or their combination.
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申请公布号 |
KR20100072804(A) |
申请公布日期 |
2010.07.01 |
申请号 |
KR20080131317 |
申请日期 |
2008.12.22 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
CHANG, YOUNG SUK;KIM, BANG DUK;LEE, YWAN HEE;PARK, JUNG EUN |
分类号 |
C08L67/03;C08L51/04;C08L67/00;C08L69/00 |
主分类号 |
C08L67/03 |
代理机构 |
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