| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder bump structure that allows smooth cleaning of flux residuals after solder fusion joint by securing a gap between an electronic component and a mounting substrate so as to prevent pores in an under-fill material even if an electrode pitch is miniaturized. <P>SOLUTION: The solder bump structure for gap control is used for joining an electrode of a mounting substrate with an electronic component electrode facing the electrode of the mounting substrate. A solder bump includes a first solder bump formed into a barrel shape after joint, and a second solder bump having a smaller volume compared with that of the first solder bump and formed into a columnar shape or a drum shape after joint. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
