| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an adherend such as a wafer from being damaged when a peeling tape is stuck to an adhesive sheet. <P>SOLUTION: An apparatus 10 for peeling a sheet includes: an adhesion means 16 for sticking a peeling tape PT to an adhesive sheet S; and a peeling means 15 for peeling the adhesive sheet S by relatively moving the peeling tape PT and a semiconductor wafer W. The adhesion means 16 includes a laser irradiation means 39. The laser irradiation means 39 is configured such that the peeling tape PT and the adhesive sheet S can be stuck by emitting a laser beam onto the peeling tape PT. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
