发明名称 PRESSURE SENSOR MODULE AND PRESSURE DETECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a pressure detecting device of which the number of components is reduced so as to achieve reduction of the height and the number of assembling processes is reduced. SOLUTION: A metallic package for accommodating a pressure sensor module is formed of a package base 52 and a package lid 54. A pressure introduction hole 56 is formed on a bottom of the package base. An O-ring 60 is fitted into a recessed portion formed around the pressure introduction hole 56. The pressure sensor module 50 is placed on the O-ring. A gap is formed between an inner side bottom face of the package base and a lower face of the pressure sensor module. A shield cable 40 is drawn from a portion where the package base and the package lid are in contact to each other. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010145193(A) 申请公布日期 2010.07.01
申请号 JP20080321874 申请日期 2008.12.18
申请人 NABTESCO CORP 发明人 SHIRATA TAKUYA;ONUMA KEISOKU
分类号 G01L19/14;H01L29/84 主分类号 G01L19/14
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