发明名称 METHOD OF MANUFACTURING ELECTRONIC APPARATUS HOUSING, ELECTRONIC APPARATUS HOUSING, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide: a method of manufacturing an electronic apparatus housing which is thin and lightweight and has high rigidity while maintaining corrosion resistance and fire retardancy; an electronic apparatus housing; and an electronic apparatus having the electronic apparatus housing. SOLUTION: The method of manufacturing the electronic apparatus housing includes a coating step of coating the entire base made of magnesium alloy with a resin layer, and a molding step of molding the base entirely coated with the resin layer and a resin-made component in one body, the electronic apparatus housing being manufactured which is thin and lightweight and has high rigidity since the base made of magnesium alloy is used, and which is enhanced in corrosion resistance and fire retardancy since the whole base is coated with the resin layer. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147376(A) 申请公布日期 2010.07.01
申请号 JP20080325336 申请日期 2008.12.22
申请人 FUJITSU LTD 发明人 ISHIZUKA MASANOBU
分类号 H05K5/02 主分类号 H05K5/02
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