METHOD FOR MANUFACTURING HEAD STACK ASSEMBLY, INTERCONNECTION DEVICE THEREOF, AND HEAD STACK ASSEMBLY

摘要

<P>PROBLEM TO BE SOLVED: To improve manufacturing yield of HSA by surely interconnecting the connector tab of the HGA and a circuit board. Ž<P>SOLUTION: The connector tab 213 of HSA and a preamplifier circuit board 211 are interconnected. According to this method, the connection pad forming surface of the connector tab is disposed to be aligned with the direction of the edge of the circuit board. A leaf spring 62 is slid along the rear surface of the connection pad forming surface, and the rear surface is pressed by the leaf spring so as to press the connection pad forming surface to the edge. In this state, the connection pad receives heat energy to be soldered. After the soldering, the leaf spring is removed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž