发明名称 SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate with a desired impurity profile by suppressing the diffusion of added impurities, and to provide a manufacturing method for the substrate. Ž<P>SOLUTION: There is provided the semiconductor substrate that includes a silicon carbon region 20 therein, with the carbon-to-silicon ratio of 2×10<SP>-5</SP>to 2×10<SP>-2;</SP>an insulation film 21 provided under the silicon carbon region 20; and a silicon region 22 provided under the insulation film 21. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010147352(A) 申请公布日期 2010.07.01
申请号 JP20080324898 申请日期 2008.12.22
申请人 TOSHIBA CORP 发明人 FUJII OSAMU
分类号 H01L21/02;H01L27/12;H01L29/786 主分类号 H01L21/02
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