发明名称 |
Ball land structure having barrier pattern |
摘要 |
Disclosed is a ball land structure suitable for use with a semiconductor package. The ball land structure includes a ball land and a barrier on a core. The barrier may be configured to connect to the ball land so as to form a barrier hole between an edge of the ball land and an edge of the barrier thus exposing a portion of the core. A solder mask may be deposited on the ball land and a portion of the core exposed by the barrier hole so as to partially expose the core.
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申请公布号 |
US2010164101(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20090654477 |
申请日期 |
2009.12.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE WANG-JAE;JUNG YONG-JIN;KIM JUNG-HYEON |
分类号 |
H01L23/498;H01R12/04 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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