发明名称 |
SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS |
摘要 |
An apparatus and method of making a package substrate with metal bumps is presented. The package substrate comprises a substrate base and a plurality of metal bumps which are formed on the substrate base. A microelectronic die may thereafter be attached to the package substrate. Also presented is a method for attaching the package substrate to a printed circuit board (PCB).
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申请公布号 |
US2010167466(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20080347800 |
申请日期 |
2008.12.31 |
申请人 |
ADIMULA RAVIKUMAR;YIM MYUNG JIN |
发明人 |
ADIMULA RAVIKUMAR;YIM MYUNG JIN |
分类号 |
H01L21/98;H05K3/30;H05K3/34;H05K7/00 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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