OLIGOMER OR POLYMER, THERMOSET RESIN COMPOSITION COMPRSING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A thermoset oligomer or a polymer, a thermosetting resin composition including thereof, and a printed circuit board using thereof are provided to secure the heat resistance, the mechanical property, and the dimensional stability of the oligomer or the polymer. CONSTITUTION: A thermoset oligomer or a polymer including a recurring unit marked with chemical formula 1, including a thermosetting functional group in the side chain. The thermoset oligomer or the polymer additionally includes the thermosetting functional group selected from the group consisting of a substituted or non-substituted aliphatic group or alicyclic group including a double bond or a triple bond, a substituted or non-substituted aryl group including the double bond or the triple bond, (iso)cyanate, or their substituent or derivative.