| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic part with excellent strength and high insulation resistance. <P>SOLUTION: The electronic part includes an inner layer section and outer layer sections formed covering the surfaces of the inner layer section, wherein the inner layer section and outer layer sections have a construction with a filler component dispersed in a glass component, the transverse rupture strength of the inner layer section is at least 330 MPa, and the inner layer section has a thermal expansion coefficient larger than that of the outer layer sections. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
