发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element which can obtain a flat film in an earlier stage of a growth process than before, in a method of manufacturing a semiconductor light-emitting apparatus including a process of forming a semiconductor layer using a lateral growth method after arranging a mask for selective growth on a substrate for growth. <P>SOLUTION: The mask for selective growth, which partially covers the substrate for growth, is formed on the substrate for growth. Next, a semiconductor film is laterally grown from a non-mask part, which is not covered with the mask on the substrate for growth, to form a through dislocation blocking layer covering the mask. Next, a device function layer containing a light-emitting layer is epitaxially grown above the through dislocation blocking layer. The process of forming the through dislocation blocking layer alternately repeats a first step and a second step of performing the growth of the semiconductor film at mutually different growth rates, under a normal pressure and a temperature atmosphere lower than the growth temperature of a device function layer. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147165(A) 申请公布日期 2010.07.01
申请号 JP20080321139 申请日期 2008.12.17
申请人 STANLEY ELECTRIC CO LTD 发明人 CHINONE TAKAKO;YANA KICHIKO;SHIBATA YASUYUKI;TONO JIRO
分类号 H01L21/205;C23C16/34;H01L33/32 主分类号 H01L21/205
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