| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a member for a circuit, in which the number of defectives such as wrinkles, fracture, etc., in a manufacturing step is decreased even when a resin film is made thin and precise circuit formation is performed; and to provide a thin type member for a circuit obtained by such a manufacturing method. SOLUTION: The method of manufacturing the member for the circuit formed by sticking a metal foil 3 and a resin film 7 together includes a step (B) of coating a metal foil stuck surface of the resin film 7 with a solvent-based adhesive 6 and sticking the metal foil 3 by dry laminating after performing a step (A) of sticking a finely adhesive film 2 for reinforcement on the opposite surface of the resin film 7 from the metal stuck surface by thermal laminating. COPYRIGHT: (C)2010,JPO&INPIT |
