发明名称 MULTILAYERED IMPINGEMENT COMPLEX FOR COOLING WALL
摘要 PROBLEM TO BE SOLVED: To provide a multilayered impingement complex for cooling a wall, which generates multiple collisional cooling flows, and also to provide a method of manufacturing the multilayered impingement complex. SOLUTION: The multilayered impingement complex has: a plurality of pinhole layers (2) each provided with a plurality of through-holes (3) dispersedly arranged over a surface thereof, the through-holes being configured as pinholes; and a plurality of web layers (6). The web layers are layered alternately with the pinhole layers (2), and each includes a plurality of webs (7). The webs are dispersedly arranged over the surface of the pinhole layer (2), and each bridges the pinhole layers. Each web (7) of one web layer (6) is aligned in a line with each web (7) of the other web layer (7), and each through-hole (3) of one pinhole layer (2) is offset with respect to a through-hole (3) of an adjacent pinhole layer (3). COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010144722(A) 申请公布日期 2010.07.01
申请号 JP20090283250 申请日期 2009.12.14
申请人 SIEMENS AG 发明人 HESELHAUS ANDREAS
分类号 F01D5/18;F01D9/02;F02C7/18 主分类号 F01D5/18
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