发明名称 |
Semiconductor device and method of fabricating the same |
摘要 |
Provided is a semiconductor device and a method of fabricating the same. The semiconductor device may include at least one logic circuit and at least one spare circuit. The at least one spare circuit may be that is a substitute for the at least one logic circuit and may not be connected to a power voltage source and/or a ground voltage source.
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申请公布号 |
US2010164537(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20090654722 |
申请日期 |
2009.12.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK BONG-IL |
分类号 |
H03K19/003;H01S4/00 |
主分类号 |
H03K19/003 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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