发明名称 ELECTROPLATING METHOD AND ELECTROPLATED PRODUCT
摘要 A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu-Sn alloy layer onto the second copper layer from a Cu-Sn electroplating solution; and electroplating a chromium layer onto the Cu-Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
申请公布号 WO2010072121(A1) 申请公布日期 2010.07.01
申请号 WO2009CN75555 申请日期 2009.12.14
申请人 BYD COMPANY LIMITED;SUN, JIPENG;LI, AIHUA;LI, ZAICHUN;PENG, BO 发明人 SUN, JIPENG;LI, AIHUA;LI, ZAICHUN;PENG, BO
分类号 C25D5/10;C25D5/30;C25D5/44 主分类号 C25D5/10
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