A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu-Sn alloy layer onto the second copper layer from a Cu-Sn electroplating solution; and electroplating a chromium layer onto the Cu-Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
申请公布号
WO2010072121(A1)
申请公布日期
2010.07.01
申请号
WO2009CN75555
申请日期
2009.12.14
申请人
BYD COMPANY LIMITED;SUN, JIPENG;LI, AIHUA;LI, ZAICHUN;PENG, BO