CLEAVING DEVICE AND CLEAVING METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

摘要

The issue is to control the adhesion of dross and the occurrence of cracking and chipping of ceramic substrates when cleaving a sealed substrate containing a ceramic substrate or metal substrate with a laser. Disclosed is a cleaving method used when manufacturing multiple electronic components by forming a sealed substrate (1) by sealing chips (3) that have been variously mounted on multiple areas (7) disposed on a circuit board (2) in resin, and then cleaving the sealed substrate (1) along the boundary lines (6) of the multiple areas (7), which cleaving method comprises a step, in which the sealed substrate (1) is affixed to a table (9), and an irradiation step, in which first and second laser lights (12, 18) are irradiated from an irradiation head (10) toward the sealed substrate (1), while the irradiation head (10) and/or sealed substrate (1) are moved relative to one another. In the irradiation step, after perforation holes (17) are formed on the boundary lines (6) by irradiating the first laser light (12), the sealed substrate (1) is cleaved by irradiating the second laser light (18) onto the boundary lines (6).