WIRING STRUCTURE AND MICRO RELAY COMPRISING SAME

摘要

Disclosed is a wiring structure for an MEMS device, which comprises a transmission line for transmitting a high frequency signal on the upper surface of a base. In the wiring structure, the base comprises, on the upper surface, an upper ground electrode which is electrically insulated from the transmission line; the upper ground electrode surrounds the transmission line; the base comprises a through interconnect that is arranged within a through hole formed in the base along the thickness direction; the through interconnect is electrically connected to the transmission line; the base comprises, on the lower surface, an external terminal that is electrically connected to the through interconnect, and a lower ground electrode that is electrically insulated from the external terminal; the lower ground electrode surrounds the external terminal; the base comprises a first shield which is formed along the thickness direction of the base and electrically insulated from the through interconnect; and the first shield is arranged in the base so as to surround the through interconnect.