| 摘要 |
PURPOSE: A grinding device is provided to partially grind a wafer by pressing a wafer on a grinding pad using the phase change of magnetic fluid from liquid to solid by a magnetic force. CONSTITUTION: A grinding device comprises a grinding pad(130), a grinding head(120), an EPD(End Point Detect) unit(140), and a magnetic force generating unit. The grinding pad grinds a wafer(W). The grinding head presses the wafer on the grinding pad. The EPD unit detects the end point of the wafer ground by the grinding pad. The magnetic force generating unit generates a magnetic force on the grinding head using the end point. Magnetic fluid(200) is formed on the underside of the grinding head, and the phase of the magnetic fluid is changed by the magnetic force. |
