发明名称 METHOD OF MANUFACTURING MICROSTRUCTURE AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide technique for stably manufacturing a microstructure using a mold. <P>SOLUTION: The microstructure is manufactured by preparing an organic resin layer of the mold having a three-dimensional microstructure on a surface, forming a metal layer which completely buries the three-dimensional microstructure and forms a common support portion on a surface of the organic resin layer and forming a bond via metal oxide on an interface between the organic resin layer and metal layer, exposing the organic resin layer to a formic acid gas and reducing the metal oxide on the interface with the metal layer with formic acid penetrating the organic resin layer to cut the bond between the metal layer and organic resin layer, peeling the metal layer having the bond cut from the organic resin layer, pressing the metal layer peeled from the organic resin layer into the organic resin layer which is softened, and removing the common support portion of the metal layer above the organic resin layer through chemimechanical polishing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010147263(A) 申请公布日期 2010.07.01
申请号 JP20080323198 申请日期 2008.12.19
申请人 FUJITSU LTD 发明人 MIZUKOSHI MASATAKA
分类号 H05K3/20;H01L23/12;H05K3/10;H05K3/26 主分类号 H05K3/20
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