| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method whereby an Si beam width which isolates the most proximate supply ports is increased and the variation of the Si beam width is reduced, and to provide a liquid ejecting head which achieves a good printing quality. <P>SOLUTION: The manufacturing method for the liquid ejecting head which has an Si substrate of a face orientation of ä100}, a channel that holds a liquid on the Si substrate, an ejection opening that ejects the liquid connecting with the channel, and the supply port that supplies the liquid to the channel connecting with the channel includes in the following sequence, a first Si removing process forming a leading hole in the Si substrate so that the most proximate supply ports align in a direction <100> of the Si substrate, and a second Si removing process of forming the supply port by Si crystal axis anisotropic etching under a condition that an etching speed of a face ä100} is lower than an etching speed of a face ä110} to the leading hole. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
