| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate connection structure that holds adhesive properties of two substrates and is free from generating a fault by current leakage or an electric short circuit between terminals, and to provide an electronic device using the same. Ž<P>SOLUTION: The connection of a first substrate with a second substrate is performed by an anisotropic conduction sheet 5 which includes laminating: a first resin 3 which does not contain conductive particles 6; and a second resin 4 which contains the conductive particles 6 and has a higher curing temperature than that of the first resin 3 and has a smaller shape than that of the first resin 3. By this configuration, the adhesive properties of both substrates can be held, and faults by the current leakage accompanying moisture absorption of a resin or electric short circuit between terminals do not arise. Moreover, the first resin 3 does not contain the conductive particles, thereby faults are not caused by the current leakage due to a portion exposed to an end surface exterior of the first substrate or electric short circuit between terminals. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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