| 摘要 |
A semiconductor device includes a circuit base including an inner lead portion and an outer lead portion. The inner lead portion has a plurality of inner leads. At least part of the inner leads is routed inside a chip mounting area. On both upper and lower surfaces of the circuit base, a first and a second semiconductor chip are mounted. At least part of electrode pads of the first semiconductor chip are electrically connected to electrode pads of the second semiconductor chip via the inner leads.
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