| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily perform POP (package-on-package) bonding at low cost, and to improve the reliability of the bonding. <P>SOLUTION: A wiring board (package) 10 has a structure in which multiple wiring layers are stacked with insulating layers each interposed between the wiring layers, and the wiring layers are connected to each other through vias formed in each insulating layer. In a region around a chip mounting area of the outermost insulating layer 12 on one surface side of the board, pads P2 are arranged, wherein the pads P2 are formed in a bump shape to cover a surface of a portion of the insulating layer 12, the portion thereof being formed to project. In the chip mounting area, pads P1 whose surfaces are exposed from the insulating layer 12 are arranged. A chip 31 is flip-chip bonded to the pads P1 of the package 10, and another package 40 is bonded to the bump shaped pads P2 around the chip (POP bonding). <P>COPYRIGHT: (C)2010,JPO&INPIT |
