| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate, capable of preventing the generation of foreign matters by preventing scattering of debris and powder stuck to the cutting surface of a multilayer substrate without increasing manufacture processes, reducing defects such as wiring defects due to the foreign matters and improving an yield, and to provide the wiring substrate. Ž<P>SOLUTION: In the method of manufacturing the wiring substrate, the wiring formation work of the conductive metal layer 3 of the multilayer substrate 7 for which the conductive metal layer 3 is formed on at least one surface of a base material 1 having an electric insulation property and containing a polymer resin is executed by photolithography using a dry film resist 8, and a wiring layer comprising a conductive metal is formed on the base material 1. A long-length roll material is used as the multilayer substrate 7, the dry film resist 8 wider than the multilayer substrate 7 is used as the dry film resist 8, and when sticking the dry film resist 8 on the conductive metal layer 3 of the multilayer substrate 7 pulled out from the roll material, the end face of the multilayer substrate 7 is covered utilizing the end part of the wide width of the dry film resist 8. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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