摘要 |
<p>A method of forming an image module includes creating a lens stack wafer including a plurality of lens stacks, determining an individual lens stack compensation for each of the lens stacks, providing an image sensor wafer package including a plurality of image sensors and a transparent wafer overlying the image sensors, forming a plurality of individual adjustment members between the transparent wafer and the lens stack wafer, a size of each individual adjustment member corresponding to individual lens stack compensations, and forming an image module wafer by securing the plurality of lens stacks, the plurality of image sensors, and the plurality of adjustment members to form a plurality of image modules, adjustment members being outside an optical path of the image module, at least one of the plurality of lens stacks and the plurality of image sensors remaining in wafer form during the forming of the image module wafer.</p> |
申请人 |
TESSERA NORTH AMERICA, INC.;ELLIOTT, PAUL;CARRIERE, JAMES;CLASSEY, JEFFREY;WELCH, KEVIN;WELCH, W., HUDSON;MATHEWS, JAY;REINA, STEPHEN |
发明人 |
ELLIOTT, PAUL;CARRIERE, JAMES;CLASSEY, JEFFREY;WELCH, KEVIN;WELCH, W., HUDSON;MATHEWS, JAY;REINA, STEPHEN |